Electronic Underfill Material Market Competition Ranking, Market Size, Market Share, Forecast Report 2025-2031

On Nov 21, Global Info Research released "Global Electronic Underfill Material Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031". This report includes an overview of the development of the Electronic Underfill Material industry chain, the market status of Electronic Underfill Material Market, and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of Electronic Underfill Material.

According to our (Global Info Research) latest study, the global Electronic Underfill Material market size was valued at US$ 741 million in 2024 and is forecast to a readjusted size of USD 1518 million by 2031 with a CAGR of 10.7% during review period.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
According to market research, the global production of Electronic Underfill Materials is expected to be approximately 250-300 tons in 2024. The price varies significantly depending on the product specifications, with the overall price range being between 2,500 to 3,000 USD per kg.
Electronic Underfill Material is used to fill the gaps between surface-mounted components (SMT) and circuit boards, mainly to improve the mechanical strength of electronic components, extend their service life, especially in high-load, high-temperature, and frequently vibrating applications. This material is typically composed of epoxy resins, silicones, polyurethanes, etc., and possesses excellent flowability, adhesion, and thermal stability. Underfill material effectively reduces thermal stress on electronic components and prevents solder joints from detaching or components from failing due to temperature fluctuations or external vibrations.
With the ongoing growth of the global electronics industry and the increasing demand for high-tech products, the market demand for underfill materials continues to rise. Particularly in sectors such as consumer electronics, automotive electronics, communication devices, and aerospace, the need for highly reliable and durable electronic components is increasing, driving the widespread application of underfill materials. With the development of 5G technology and the proliferation of electric vehicles and smart devices, the growth potential of this market is significant, and it is expected to continue its stable growth in the coming years.
With the increasing global demand for high-performance electronic products, the market for Electronic Underfill Materials faces huge development opportunities. First, the rapid promotion of 5G communication technology has raised higher requirements for the reliability of electronic components, which directly drives the increased demand for underfill materials. In addition, the popularity of electric vehicles makes automotive electronics increasingly demanding, especially in high-temperature and high-load environments such as battery management systems and in-vehicle sensors. Underfill materials have become a key technology to ensure the stable operation of electronic components. Furthermore, the development of emerging technologies such as smart homes, IoT, and wearable devices has also driven the demand for more precise and reliable circuit boards, providing more opportunities for the underfill material market. The continuous technological advancement and the diversification of market demands provide a promising future for the industry.
Although the market for Electronic Underfill Materials has a broad prospect, the industry still faces some challenges and risks. First, fluctuations in raw material prices and the rising production costs may put significant pressure on small businesses, especially against the backdrop of increasing global economic uncertainties. Secondly, as the application scope of underfill materials expands, there is an increasing demand for higher performance materials, such as better thermal stability and stronger corrosion resistance, which raises the technical requirements for production. The investment in technological research and development and the enhancement of innovation capabilities are crucial for enterprises to stand out in the market, and this requires high R&D costs. Furthermore, stricter global environmental regulations on the production and use of materials present environmental and safety challenges. Whether the materials meet new environmental standards has become a key factor restricting industry development.
The downstream demand for Electronic Underfill Materials is mainly driven by technological advancements in various industries. The demand in the consumer electronics sector continues to increase, especially for products such as smartphones and laptops, where higher production process standards push the demand for high-performance underfill materials. At the same time, the rapid development of the automotive electronics market, especially in electric vehicles and autonomous driving, further raises the performance requirements for circuit boards, increasing the demand for reliable and high-temperature-resistant underfill materials. The aerospace industry also has strict reliability requirements for circuit boards, leading to a growing demand for underfill materials in this field. Additionally, with the popularization of IoT and smart homes, the demand for high-performance circuit boards in these emerging fields continues to rise, further expanding the underfill material market.
This report is a detailed and comprehensive analysis for global Electronic Underfill Material market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

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Market segment by Type: Capillary Underfill Material (CUF)、 No Flow Underfill Material (NUF)、 Molded Underfill Material (MUF)
Market segment by Application: Flip Chips、 Ball Grid Array (BGA)、 Chip Scale Packaging (CSP)
Major players covered:  Henkel、 NAMICS Corporation、 Panasonic Lexcm、 Resonac (Showa Denko)、 Hanstars、 Shin-Etsu Chemical、 MacDermid Alpha、 ThreeBond、 Parker LORD、 Nagase ChemteX、 Bondline、 AIM Solder、 Zymet、 Panacol-Elosol GmbH、 Dover、 Darbond Technology、 Yantai Hightite Chemicals、 Sunstar、 DeepMaterial、 SINY、 GTA Material、 H.B.Fuller、 Fuji Chemical、 United Adhesives、 Asec Co.,Ltd.
Market segment by region, regional analysis covers: North America (United States, Canada and Mexico), Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe), Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia),South America (Brazil, Argentina, Colombia, and Rest of South America),Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa).

The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Electronic Underfill Material product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Electronic Underfill Material, with price, sales, revenue and global market share of Electronic Underfill Material from 2020 to 2025.
Chapter 3, the Electronic Underfill Material competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Electronic Underfill Material breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2020 to 2024.and Electronic Underfill Material market forecast, by regions, type and application, with sales and revenue, from 2025 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Electronic Underfill Material.
Chapter 14 and 15, to describe Electronic Underfill Material sales channel, distributors, customers, research findings and conclusion.

Data Sources:
Via authorized organizations:customs statistics, industrial associations, relevant international societies, and academic publications etc.
Via trusted Internet sources.Such as industry news, publications on this industry, annual reports of public companies, Bloomberg Business, Wind Info, Hoovers, Factiva (Dow Jones & Company), Trading Economics, News Network, Statista, Federal Reserve Economic Data, BIS Statistics, ICIS, Companies House Documentsm, investor presentations, SEC filings of companies, etc.
Via interviews. Our interviewees includes manufacturers, related companies, industry experts, distributors, business (sales) staff, directors, CEO, marketing executives, executives from related industries/organizations, customers and raw material suppliers to obtain the latest information on the primary market;
Via data exchange. We have been consulting in this industry for 16 years and have collaborations with the players in this field. Thus, we get access to (part of) their unpublished data, by exchanging with them the data we have.

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